as per link:
"The thermal conductivity or heat transfer rate of copper is 92% versus aluminum which is approximately 49%. However, the copper fin bonded to the tubes, or water passages, using lead solder is very inefficient and slows the heat transfer rate to just slightly better than that of aluminum."
Doesn't address directly the issue of the lower conductivity of the brass tubes vs/alum.
Explain the method of ameliorating the copper/brass interface to any significant degree in this situation.
I'm also wondering, what exactly does "92%" and "49%" referenced to, pure water?